Silicon Carbon Nitride Thin Films Produced by Magnetron Reactive Sputtering Physical Vapour Deposition: Structural, Chemical and Mechanical Characterisation

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Authors

  • Laboratoire de Physique Fondamentale et Appliquée, UFR Sciences Fondamentales et Appliquées, Université Nangui Abrogoua, 02 BP 801 Abidjan 02 ,CI
  • Ecole Supérieure Africaine des Technologies de l'Information et de la Communication (ESATIC), Abidjan ,CI
  • Laboratoire de Physique Fondamentale et Appliquée, UFR Sciences Fondamentales et Appliquées, Université Nangui Abrogoua, 02 BP 801 Abidjan 02 ,CI
  • C. R. P. Gabriel Lippmann, S. A. M., 41 rue du Brill, L-4422 Belvaux ,LU
  • C. R. P. Gabriel Lippmann, S. A. M., 41 rue du Brill, L-4422 Belvaux ,LU
  • Institut Jean Lamour (IJL) CNRS UMR 7198, Université de Lorraine, Faculté des Sciences et Technologies, BP 239, F-54506 Vandoeuvre Cedex ,FR

DOI:

https://doi.org/10.18311/jsst/2017/11022

Keywords:

Magnetron Sputtering, Silicon Carbon Nitride (SiCN), SEM, TEM, EDSX, FTIR, Scratch Tests
thin film deposition and characterization

Abstract

Amorphous silicon carbon nitride films were deposited on silicon and WC-Co substrates by magnetron reactive sputtering in Ar/N2 gas mixture with carbon and silicon targets. The influence of experimental parameters on the films morphological, structural and mechanical properties was studied. The general morphology of the film is observed by SEM and TEM. EDXS and FTIR were used to determine the film chemical composition and the nature of chemical bonding. It was observed that C≡N bonds and nitrogen percentage in the film are promoted when the substrate is biased. The role of an underlayer and the influence of its nature on the film adhesion on WC/Co substrates were also studied. In this case, nanoscratch tests showed that a SiNx thin film could be an appropriate underlayer.

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Published

2017-07-24

How to Cite

Kouakou, P., Yoboue, P., Ouattara, B., Hody, V., Choquet, P., & Belmahi, M. (2017). Silicon Carbon Nitride Thin Films Produced by Magnetron Reactive Sputtering Physical Vapour Deposition: Structural, Chemical and Mechanical Characterisation. Journal of Surface Science and Technology, 33(1-2), 44–52. https://doi.org/10.18311/jsst/2017/11022

Issue

Section

Articles
Received 2016-12-30
Accepted 2017-05-08
Published 2017-07-24

 

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